The working principle of micromachining mainly includes the following aspects:
Surface micromachining: The mechanism of surface micromachining includes depositing an isolation layer on the silicon wafer for electrical insulation or substrate protection, then depositing a sacrificial layer and pattern processing, then depositing a structural layer and processing the pattern, and finally dissolving the sacrificial layer to form a cantilever beam microstructure. This processing method is suitable for the processing of tiny structural parts, especially for processing cantilever beams, gear sets, turbines, cranks and other complex surface microstructure parts.
Laser micro-nano processing: Laser micro-nano processing technology uses laser beams as processing tools to accurately process materials at the micron or even nanometer scale through high-energy-density laser beams. The interaction between laser and matter includes reflection, absorption and transmission. The light energy absorbed by the material is converted into heat energy, resulting in a local temperature increase of the material, which in turn triggers melting, vaporization, phase change or chemical reaction. High-precision processing can be achieved by precisely controlling parameters such as the energy density, spot size and irradiation time of the laser beam.
Two-photon polymerization technology: The micromachining workbench adopts two-photon polymerization technology, and its resolution can reach 1 micron. This technology uses two photons to act on the material at the same time, causing it to polymerize at a specific location, thereby achieving high-precision micromachining.
Ultraviolet exposure technology: Ultraviolet exposure technology is the core technology for manufacturing large-scale integrated circuits and semiconductor devices. Through specific ultraviolet band exposure, development and etching process, the pattern on the mask is engraved on the silicon substrate. This technology has the advantages of large-area processing, easy operation and good repeatability.
Femtosecond laser micromachining: Femtosecond laser micromachining uses the high peak intensity and extremely short action time of ultrashort pulse lasers to accurately control or manipulate the state of materials. Due to the extremely high energy density and extremely short action time, the heat-affected zone of the processed material is greatly reduced, thereby processing the ideal result.